High strength, high rigidity, and deformation resistance; excellent stress relaxation resistance and creep resistance; extremely strong high-temperature softening resistance; moderate conductivity with balanced heat dissipation; fine and uniform grain structure; dense and clean surface with strong adhesion for nickel, silver, and gold plating; flat shape with no waves or camber; excellent corrosion resistance. Applications: ICs for integrated circuits, consumer electronics general-purpose ICs, SOP, SOIC, TSSOP, ultra-thin DFN/QFN, SOT series power management chips, memory chips, small logic chips, sensor ICs; medium and low-power semiconductor discrete devices, small-signal transistors, low-voltage diodes, Zener diodes; LED lighting package brackets, COB, high-power LED bead brackets.