Excellent thermal and electrical conductivity; ultra-high heat resistance and softening resistance; fine and uniform grain structure with low stress relaxation rate; dense and clean surface with strong adhesion for nickel, silver, and gold plating; good cold formability, bending without cracking; stable copper wire/aluminum wire ultrasonic bonding performance; excellent soft soldering and brazing performance; flat shape with no waves or camber. Applications: power semiconductor discrete devices, small-signal power transistors, power switch tubes; IC packaging for integrated circuits, consumer electronics, power management ICs, driver chips, automotive-grade chips, on-board sensors, complete vehicle MCUs; servo drives, welding machine power discretes; high-power LED brackets.