Standard thickness range: 9–35 μm, tensile strength ≥ 300 N/mm², elongation ≥ 6%. Ultra-low roughness, extremely low signal loss, high elongation and fine etching performance. Applied to AI servers, high-level autonomous driving millimeter-wave radars, premium ABF carrier substrates, ultra-thin HDI fine circuits, 6G pre-research RF boards and millimeter-wave high-frequency communication mainboards.