Standard thickness range: 9–35 μm, tensile strength ≥ 300 N/mm², elongation ≥ 4%. Low surface roughness, resistant to delamination and blistering during high-temperature lamination; clean etching effect and stable impedance control. Compatible with medium-low loss copper-clad laminates such as FR-4, PPO and hydrocarbon substrates. Used in 5G communication equipment, servers, computing hardware, automotive electronics and high-speed HDI boards.